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Hot Pressed Boron Nitride / HPBN

Description

Price largely depends on the geometry of the product but is approximately 5 or 10 times as high as steel. HPBN stands for High Pressure Boron Nitride. The boron nitride which is described in this record has a simular structure as graphite (hexagonal). This hexagonal boron nitride is soft and platelike. There also exists a cubic form of boron nitride (beta-BN or borazon), of which the structure is simular to diamond. The cubic boron nitride is much harder than the hexagonal boron nitride, and is used as grinding material or for the manufacture of metal-cutting tools. The properties of this material are almost equal to diamond, and so is the price.

General

Boron Nitride (Hot Pressed), Hot Pressed Boron Nitride, HPBN

Properties

Chemical properties

Minimum value Maximum value Unit Sources
%
%

Electrical properties

Minimum value Maximum value Unit Sources
kV/mm
%
V
1000000000 1.00E+015 Ohm.mm²/m Idemat 2003

Manufacturing Properties

Minimum value Maximum value Unit Sources

Mechanical properties

Minimum value Maximum value Unit Sources
70 70 MPa Idemat 2003
800 800 MPa Idemat 2003
MPa
1800 1800 kg/m³ Idemat 2003
%
MPa
J/cm
MPa
MPa
MPa
MPa
30000 30000 MPa Idemat 2003

Optical properties

Minimum value Maximum value Unit Sources

Thermal properties

Minimum value Maximum value Unit Sources
°C
°C
20 1000 °C Idemat 2003
J/kg.K
40 40 W/m.K Idemat 2003
2.5 2.5 e-6/K Idemat 2003

Environment

mPt
Pt
mELU
MJ/MJ
MJ
kg
kg
Idemat 2003, Design for Sustainability, Delft University of Technology

Tags

Tags: Electrical Properties: Resistivity < 1e+20 Ohm.mm²/m , Maximum Resistivity ≥ 0, 01 Ohm.mm²/m , Maximum Resistivity ≥ 0, 1 Ohm.mm²/m , Maximum Resistivity ≥ 1 Ohm.mm²/m , Maximum Resistivity ≥ 1e+10 Ohm.mm²/m Mechanical Properties: Bending Strength < 100 Mpa , Bending Strength < 1.000 Mpa , Maximum Bending Strength ≥ 0, 1 MPa , Maximum Bending Strength ≥ 1 MPa , Maximum Bending Strength ≥ 10 MPa , Compressive strength < 1.000 MPa , Maximum compressive strength ≥ 0, 1 MPa , Maximum compressive strength ≥ 1 MPa , Maximum compressive strength ≥ 10 MPa , Maximum compressive strength ≥ 100 MPa , Density < 5.000 kg/m³ , Density < 10.000 kg/m³ , Maximum Density ≥ 1 kg/m³ , Maximum Density ≥ 5 kg/m³ , Maximum Density ≥ 10 kg/m³ , Maximum Density ≥ 50 kg/m³ , Maximum Density ≥ 100 kg/m³ , Maximum Density ≥ 500 kg/m³ , Maximum Density ≥ 1.000 kg/m³ , Maximum impact strength ≥ 0, 1 J/cm , Maximum impact strength ≥ 1 J/cm , Maximum impact strength ≥ 10 J/cm , Maximum impact strength ≥ 100 J/cm , Maximum impact strength ≥ 1.000 J/cm , Tensile strength < 1.000 Mpa , Maximum tensile strength ≥ 1 Mpa , Maximum tensile strength ≥ 10 Mpa , Maximum tensile strength ≥ 100 Mpa , Young's modulus < 50.000 Mpa , Young's modulus < 100.000 Mpa , Young's modulus < 150.000 Mpa , Young's modulus < 200.000 Mpa , Young's modulus < 250.000 Mpa , Young's modulus < 300.000 Mpa , Young's modulus < 350.000 Mpa , Young's modulus < 400.000 Mpa , Maximum Young's modulus ≥ 5.000 Mpa , Maximum Young's modulus ≥ 10.000 Mpa Thermal Properties: Minimum service temperature < 50 °C , Minimum service temperature < 100 °C , Maximum service temperature > 50 °C , Maximum service temperature > 100 °C , Maximum service temperature > 500 °C , Thermal conductivity < 100 W/m.K , Maximum thermal conductivity ≥ 0, 1 W/m.K , Maximum thermal conductivity ≥ 1 W/m.K , Maximum thermal conductivity ≥ 10 W/m.K , Thermal expansion < 5e-6/K , Thermal expansion < 10e-6/K , Thermal expansion < 50e-6/K , Thermal expansion < 100e-6/K , Maximum thermal expansion ≥ -1e-6/K , Maximum thermal expansion ≥ 1e-6/K Material Categories: Advanced Ceramic , Ceramic , Crystalline Ceramic , Engineering Ceramic , Fine Ceramic , Inorganic Compound , Nitride Ceramic , Non-metallic Material , Technical Ceramic